Plastic mitochondria-endoplasmic reticulum (ER) contacts use chaperones and tethers to mould their structure and signaling
Author:
Funder
NSERC
Publisher
Elsevier BV
Subject
Cell Biology
Reference103 articles.
1. Submicroscopical structure of cytoplasmic basophils in the liver, pancreas and salivary gland; study of ultrafine slices by electron microscope;Bernhard;Z Zellforsch Mikrosk Anat,1952
2. Close topographical relationship between mitochondria and ergastoplasm of liver cells in a definite phase of cellular activity;Bernhard;J Biophys Biochem Cytol,1956
3. Mitochondria isolated from rat brown adipose tissue and liver;Lever;J Biophys Biochem Cytol,1958
4. The outer membrane of yeast mitochondria: isolation of outside-out sealed vesicles;Riezman;EMBO J,1983
5. Exchange of phospholipids between liver mitochondria and microsomes in vitro;Wirtz;J Biol Chem,1968
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