A simple model for multipass steel welds
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference31 articles.
1. Computer model for prediction of heat-affectedzone microstructures in multipass weldments
2. The transformation hardening of steel surfaces by laser beams—I. Hypo-eutectoid steels
3. A second report on diagrams of microstructure and hardness for heat-affected zones in welds
4. A model for the development of microstructure in low-alloy steel (Fe-Mn-Si-C) weld deposits
5. An algorithm for modelling microstructural development in weld heat-affected zones (part a) reaction kinetics
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