Retardation of intergranular fracture at intermediate temperatures by a boundary node in a Cu−9 at.% Al alloy tricrystal
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference13 articles.
1. Mechanisms of Creep Fracture;Evans,1984
2. Grain boundary structure and related phenomena;Hashimoto,1986
3. Grain-boundary sliding and triple-point fold in aluminum tricrystals
4. Suppression of grain-boundary sliding by a boundary node in Cu-9at.%A1 tricrystals
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2. Creep Fracture of Copper Tricrystal along Grain Boundaries;MATERIALS TRANSACTIONS;2022-08-01
3. Grain-Boundary Sliding and Its Accommodation at Triple Junctions in Aluminum and Copper Tricrystals;MATERIALS TRANSACTIONS;2019-01-01
4. Effects of Grain-Boundary Sliding and Plastic Deformation of Grains on the Formation of Grain-Boundary Cracks in a Double Cylindrical Bicrystal of a Cu-SiO2 Alloy;MATERIALS TRANSACTIONS;2007
5. Nucleation of dynamic recrystallization at triple junctions in polycrystalline copper;Philosophical Magazine;2005-08-11
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