Power Electronic Modules-Reference-Cited by-同舟云学术

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Power Electronic Modules

Published:2018 Issue: Volume: Page:157-173
ISSN:
Container-title:Power Electronics Handbook
language:
Short-container-title:

Author:

Santi Enrico,Eskandari Soheila,Tian Bo,Peng Kang

Publisher

Elsevier

Reference18 articles.

1. Online resource, www.HYBOND.com (Accessed 23 February 2017).

2. Online resource, www.hesse-mechatronics.com (Accessed 23 February 2017).

3. Automatic wedge bonding with ribbon wire for high frequency applications;Wei Qin,2002

4. Power Electronic Modules Design and Manufacture;Sheng,2005

5. Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips;Xingsheng,2001

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Time-Resolved Non-Linear Electric Field Simulation on Liquid Embedded Substrate;2022 IEEE 21st International Conference on Dielectric Liquids (ICDL);2022-05-29

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