The History of Plasma Processing-Reference-Cited by-同舟云学术

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The History of Plasma Processing

Published:1984 Issue: Volume: Page:1-24
ISSN:0736-7031
Container-title:Plasma Processing for VLSI
language:
Short-container-title:

Author:

TOLLIVER DONALD L.

Publisher

Elsevier

Reference5 articles.

1. The deposition of vitreous silicon dioxide films from silane;Goldsmith;RCA Review,1967

2. A. Jacob, U.S. patent 3,795,557 (1974).

3. “Etching”;Reinberg,1976

4. J. M. Harvilchuck, J. S. Logan, W. C. Metzger, and P. M. Schaible, U.S. patent 3,994,793 (1976).

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electron heating mode transitions in a low pressure capacitively coupled oxygen discharge;Plasma Sources Science and Technology;2019-04-24

2. A volume averaged global model study of the influence of the electron energy distribution and the wall material on an oxygen discharge;Journal of Physics D: Applied Physics;2015-11-16

3. On the formation and annihilation of the singlet molecular metastables in an oxygen discharge;Journal of Physics D: Applied Physics;2015-07-13

4. Electron bounce resonance heating in dual-frequency capacitively coupled oxygen discharges;Plasma Sources Science and Technology;2013-03-18

5. Oxygen discharges diluted with argon: dissociation processes;Plasma Sources Science and Technology;2007-04-19

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