Annealing and recrystallization kinetics of ultrathin gold wires: Modulus and resistivity measurements-Reference-Cited by-同舟云学术

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Annealing and recrystallization kinetics of ultrathin gold wires: Modulus and resistivity measurements

Published:1988-04 Issue:4 Volume:22 Page:501-505
ISSN:0036-9748
Container-title:Scripta Metallurgica
language:en
Short-container-title:Scripta Metallurgica

Author:

Busch K,Künzi H.U,Ilschner B

Publisher

Elsevier BV

Subject

General Engineering

Reference14 articles.

1. A comparative study of the mechanical properties of bonding wires;Hannula;Semiconductor processing ASTM STP 850,1984

2. Gold wire for automated bonding;Gehman,1980

3. Metallurgical behavior of gold wire in thermal compression bonding;Ramsey,1973

4. Ball bonding with low cost ultrafine wires;Bischoff,1982

5. Evaluation of mechanical properties of thin wires for electrical interconnections;Hannula;IEEE Vol. CHMT-6 No. 4,1983

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of cold work on the mechanical response of drawn ultra-fine gold wire;Computational Materials Science;2010-07

2. A brief review of selected aspects of the materials science of ball bonding;Microelectronics Reliability;2010-01

3. Metal-Ceramic Interface Evaluation of a Gold-Infiltrated Alloy;Journal of Prosthodontics;2009-10

4. The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing;Materials Science Forum;2007-07

5. Investigation on cold-drawn gold bonding wire with serial and reverse-direction drawing;Materials Science and Engineering: A;2006-09

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