Author:
Yun H.K.,Cho K.,Kim J.K.,Park C.E.,Sim S.M.,Oh S.Y.,Park J.M.
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference11 articles.
1. Polymeric Materials for Electronic Packaging and Interconnection;Wachsman,1989
2. Mechanism of electromigration in ceramic packages induced by chip-coating polyimide
3. Plastic Packaging of Microelectronic Devices;Manzione,1990
4. Polymers for Microelectronics: Resists and Dielectrics;Makino,1994
5. Surface modification of PMDA-oxydianiline polyimide. Surface structure-adhesion relationship
Cited by
43 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献