Corrosion protection and adhesion promotion for polyimide/copper system using silane-modified polymeric materials
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference40 articles.
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2. Polyimides: materials, chemistry and characterization;Feger,1989
3. Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching
4. Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment
5. Adhesion behavior of CuCr alloy/polyimide films under 350°C and 85° C /85 % RH environments*
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