Finite element analysis of the effect of sequential cuts and tool–chip friction on residual stresses in a machined layer
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Civil and Structural Engineering
Reference30 articles.
1. Single-step superfinish hard machining: feasibility and feasible cutting conditions;Liu;Journal of Robotics and Computer-Integrated Manufacturing,1996
2. Turning versus grinding — a comparison of surface integrity aspects and attainable accuracy;Konig;Annals of the CIRP,1993
3. Liu CR, Barash MM. The mechanical state of the sublayer of a surface generated by chip-removal process, Part 1: cutting with a sharp tool. Transactions of the ASME, Journal of Engineering for Industry 1976a;November:1192–201.
4. Liu CR, Barash MM. The mechanical state of the sublayer of a surface generated by chip-removal process, Part 2: cutting with a tool with flank wear. Transactions of the ASME, Journal of Engineering for Industry 1976b;November:1202–8.
5. Variables governing patterns of mechanical residual stress in a machined surface;Liu;Transactions of the ASME, Journal of Engineering for Industry,1982
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