Soft robotic structures by smart encapsulation of electronic devices-Reference-Cited by-同舟云学术

Soft robotic structures by smart encapsulation of electronic devices

Published:2020 Issue: Volume:52 Page:277-282
ISSN:2351-9789
Container-title:Procedia Manufacturing
language:en
Short-container-title:Procedia Manufacturing

Author:

Winkler Anja,Ehrenhofer Adrian,Wallmersperger Thomas,Gude Maik,Modler Niels

Publisher

Elsevier BV

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering

Reference28 articles.

1. Haney SK, Teh WH, Eid F, Oster SN, inventor. Hermetic encapsulation for microelectromechanical systems (MEMS) devices. US 20170022050A1. Jan. 26. 2017.

2. Joseph R Tomlinson, inventor. Encapsulation of electronic circuits. US3153694A. Oct. 20. 1964.

3. Simulation and experimental investigation of active lightweight compliant mechanisms with integrated piezoceramic actuators;Modler;Smart Mater. Struct.,2016

4. Numerical and Experimental Characterization of Fiber-Reinforced Thermoplastic Composite Structures with Embedded Piezoelectric Sensor-Actuator Arrays for Ultrasonic Applications;Holeczek;Applied Sciences,2016

5. Automatic Design and Manufacture of Soft Robots;Hiller;IEEE Trans. Robot.,2012

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