Concept of a Bonding Technology for Dies below 150 Micrometers-Reference-Cited by-同舟云学术

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Concept of a Bonding Technology for Dies below 150 Micrometers

Published:2020 Issue: Volume:52 Page:9-13
ISSN:2351-9789
Container-title:Procedia Manufacturing
language:en
Short-container-title:Procedia Manufacturing

Author:

Gottwald Simon Nicolas,Reitz Birger,Albrecht Daniel,Overmeyer Ludger

Funder

Bundesministerium für Bildung und Forschung

Publisher

Elsevier BV

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering

Reference21 articles.

1. Microelectronics Packaging Handbook;Tummala,1997

2. Advanced Flip Chip Packaging;Tong,2013

3. Reichel H. Systemintegration in der Mikroelektronik: Technologien für die 3. Dimension (Heterointegration) in der Leiterplattenfertigung. In: SMT Hybrid Packaging, Messe & Kongress. Nürnberg, 2006. Tagungsband, Berlin: VDE-Verlag, 2006.

4. Ultra-thin Chip Technology and Applications;Burghartz,2011

5. Brandl F, Monser HP, Niklas S. System und Verfahren zum Ausrichten elektronischer Bauteile. Roding. DE 10 2016 004 592 B4, 2017.11.02

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. On-the-fly bare die bonding based on laser induced forward transfer (LIFT);CIRP Annals;2022

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