Flexible Microsystems Using Over-molding Technology
Author:
Funder
Interreg
Publisher
Elsevier BV
Subject
Artificial Intelligence,Industrial and Manufacturing Engineering
Reference9 articles.
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3. O. Rusanen, T. Simula, P. Niskala, V. Lindholm and M. Heikkinen, Injection Molded Structural Electronics Brings Surfaces to Life. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).Pisa, Italy, 2019, pp.1--7, D:10.23919/EMPC44848. 2019.8951795.
4. N. J. Teh, S. Prosser, P. P. Conway, P. J. Palmer and A. Kioul, "Embedding of electronics within thermoplastic polymers using injection moulding technique," Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146), Santa Clara, CA, USA, 2000, pp. 10--18, DOI: 10.1109/IEMT.2000.910703.
5. Protocols for the Measurement of Adhesive Fracture Toughness by Peel Tests;Kawashita;The Journal of Adhesion,2006
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2. A Study on Over-Molded Copper-Based Flexible Electronic Circuits;Micromachines;2022-10-16
3. The integration of electronic circuits in plastics using injection technologies: a literature review;Flexible and Printed Electronics;2022-05-03
4. Over-molding of flexible polyimide-based electronic circuits;Flexible and Printed Electronics;2021-06-01
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