Author:
Nayak Bedamati,Babu N. Ramesh
Subject
Artificial Intelligence,Industrial and Manufacturing Engineering
Reference22 articles.
1. Marcyk, G. and Cadien, K., Intel Corp, 2000.Low temperature chemical mechanical polishing of dielectric materials U.S. Patent 6,121,144.
2. An investigation of grinding and wheel loading using acoustic emission;Dornfeld;Journal of Engineering for Industry,1984
3. Experimental investigations on ice bonded abrasive polishing of copper materials;Mohan;Materials and Manufacturing Processes,2010
4. Design, development, and characterization of ice bonded abrasive polishing process;Mohan;International Journal of Abrasive Technology,2011
5. Ultrafine finishing of metallic surfaces with the ice bonded abrasive polishing process;Mohan;Materials and Manufacturing Processes,2012
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献