Integration of flexible, recyclable, and transient gelatin hydrogels toward multifunctional electronics
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference69 articles.
1. Environment: Waste production must peak this century
2. Resilient yet entirely degradable gelatin-based biogels for soft robots and electronics
3. Electronic waste generation, recycling and resource recovery: Technological perspectives and trends
4. Edible Electronics: Biocompatible and Biodegradable Materials for Organic Field-Effect Transistors (Adv. Funct. Mater. 23/2010)
5. A Physically Transient Form of Silicon Electronics
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Regenerated cellulose hydrogel with excellent mechanical properties for flexible sensors;Industrial Crops and Products;2024-04
2. Super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for electromagnetic interference shielding;Composites Part A: Applied Science and Manufacturing;2024-01
3. Transient, printable and recyclable gelatin hydrogels with enhanced mechanical sensing and electromagnetic shielding performance by incorporation of reduced graphene oxide;Chemical Engineering Journal;2023-11
4. Lithium chloride-driven enhanced conductivity of silicone-encapsulated polyacrylamide/alginate/ionic liquid-based transparent hydrogel for high-performance pressure-sensitive EMI shielding applications;Journal of Materials Science;2023-10
5. Recent progress of bio-based smart wearable sensors for healthcare applications;Materials Today Electronics;2023-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3