Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200°C-Reference-Cited by-同舟云学术

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Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200°C

Published:2010-07-15 Issue:2 Volume:82 Page:508-515
ISSN:0039-9140
Container-title:Talanta
language:en
Short-container-title:Talanta

Author:

Howlader M.M.R.,Kibria M.G.,Zhang F.,Kim M.J.

Publisher

Elsevier BV

Subject

Analytical Chemistry

Cited by 39 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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