The current status of metallization in integrated circuit applications-Reference-Cited by-同舟云学术

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The current status of metallization in integrated circuit applications

Published:1989-08 Issue: Volume:116 Page:143-151
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Holwill R.J

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference51 articles.

1. IEEE VLSI Interconnection Conf.;Thomas,1987

2. IEEE VLSI Interconnection Conf.;Nagiub,1987

3. IEEE VLSI Interconnection Conf.;Bartush,1987

4. IEEE VLSI Multilevel Interconnection Conf.;Doan,1988

5. IEEE VLSI Multilevel Interconnection Conf.;Oakley,1988

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Raman spectroscopy of polycrystalline molybdenum silicide thin films;Materials Letters;1997-02

2. Microstructural studies of molybdenum silicide thin films by spectroscopic ellipsometry;Materials Letters;1997-01

3. Ellipsometric studies of polycrystalline molybdenum silicide thin films;Materials Research Bulletin;1996-11

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