The influence of loading methods on fatigue crack initiation in polycrystalline copper at ambient temperature
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Microstructural studies on the initiation and growth of small fatigue cracks at 298, 77 and 4.2 K in polycrystalline copper;Kwon;Acta Metall.,1989
2. Fatigue damage in copper single crystals at room and cryogenic temperatures;Kwon;Acta Metall.,1989
3. Elastic strain energy analysis of the dislocation structures in fatigue;Kwon;Acta Metall.,1988
4. Eigenstrain analysis of the dislocation structures formed in copper during low temperature fatigue;Kwon;Scr. Metall.,1990
5. Overview of fatigue behavior in copper single crystals—I. Surface morphology and stage I crack initiation sites for tests at constant strain amplitude;Ma;Acta Metall.,1989
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