Creep behaviour of polycrystalline intermetallic Ti-53.4mol.%Al-Reference-Cited by-同舟云学术

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Creep behaviour of polycrystalline intermetallic Ti-53.4mol.%Al

Published:1989-07 Issue: Volume:114 Page:13-19
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Takahashi Tohru,Nagai Hashiru,Oikawa Hiroshi

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. M.J. Blackburn and M.P. Smith, U.S. Patent 4294615, October 13, 1981.

2. The deformation and fracture of TiAl at elevated temperatures;Lipsitt;Metall. Trans. A,1975

3. Deformation of TiAl intermetallic compound at elevated temperatures;Nobuki;Nippon Kinzoku Gakkai-shi,1986

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1. Evolution of microstructure during creep in gamma Ti-52Al at 1100 K and high applied stresses;INT J MATER RES;2022

2. Wrought Processing;Gamma Titanium Aluminide Alloys;2011-09-15

3. Evolution of microstructure during creep in gamma Ti–52Al at 1100 K and high applied stresses;Zeitschrift für Metallkunde;2004-11

4. Analysis of the minimum creep rates of TiAl alloys;Materials Science and Engineering: A;2003-12

5. Creep characteristics and internal stress in γ-TiAl;Materials Science and Engineering: A;2002-06

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