Punch tip effects in diffusional impression creep
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Impression creep; a new creep test
2. Impression creep of LiF single crystals
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Nb solution influencing on phase transformation temperature of Ni47Ti44Nb9 alloy;Journal of Alloys and Compounds;2014-10
2. Creep Behavior of Lead Free Solder Interconnects in Microelectronic Packages: Impression Creep Testing and Constitutive Modeling;Advances in Electronic Packaging, Parts A, B, and C;2005-01-01
3. A mechanics-induced complication of impression creep and its solution: application to Sn–3.5Ag solder;Materials Science and Engineering: A;2004-08
4. Impression creep and other localized tests;Materials Science and Engineering: A;2002-01
5. Creep behaviour of Fe3Al-based alloys in DO3 phase field;Intermetallics;2000-09
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