Author:
Deyong L.,Tremblay R.,Angers R.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference11 articles.
1. Un nouveau matériau pour la connectique : l’alliage cuivre-nickel-étain
2. Rapidly solidified CuNiSn alloys: their metallurgical and electrochemical properties;Deyong,1989
3. Fabrication of shaped charge liners from rapidly solidified powders;Angers,1988
4. Precipitation in a Cu-20%Ni-8%Sn Alloy and the Phase Diagram of the Cu–Ni Rich Cu–Ni–Sn System
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