Direct bonding of copper to aluminum nitride
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference17 articles.
1. Nonmetallic crystals with high thermal conductivity
2. Microstructural Effects on the Thermal Conductivity of Polycrystalline Aluminum Nitride
3. Transparent AIN ceramics
4. Overview of multichip technology;Balde,1982
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