1. Packaging trends of power electronic modules;Nguyen;Advancing Microelectronics,1997
2. An overview of the DOD needs for power electronics and power electronics packaging;Harris;Advancing Microelectronics,1997
3. Packaging of power electronics for high temperature applications;McCluskey;Advancing Microelectronics,1998
4. Krum A. Measuring thermal resistance — An exploration of direct or indirect techniques. Advanced Packaging 1999; May: 28–34.
5. New SiC/Al base plates for high performance power modules;White,1996