1. Esprit project 26261: LAP, Low cost large area panel processing of MCM-D substrates and packages, 1998. http://www. ife.ee.ethz.ch/hdp/lap
2. Scheffler M, Cottet D, Grzyb J, Tröster G, Delaney K, Ammann N, Preyss W, Baumbach J, Poyet P, Tessier G, Bodö P, Leisner P, Wahlstrom U, Persson S-T, Ljungqvist L, Wendel W, Epple R, Centro T, Catarsi F, Demmer P. LAP: low cost large area panel processing of MCM-D substrates and packages – achievements and results. Proceedings of the International Electronic Packaging Technical Conference, Hawaii, USA, 8–13 July 2001, in press
3. Tessier T, Myszka E. Approaches in cost reducing MCM-D substrate fabrication. Proceedings of the Electronic Components and Technology Conference (ECTC'93), 1993. p. 570–8
4. Laursen L, Garrou P. Consortium for intelligent large area processing CILAP. Proceedings of the International MCM Conference (MCM-Denver'95), 1995. p. 253–8
5. Garrou PE, Tessier TG. Multichip module technology handbook, high-density, large-area-processing (LAP). New York: McGraw-Hill; 1998 (Chapter 5)