Author:
Dilhac J-M.,Cornibert L.,Ganibal C.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Pezzani R, Bernier E, Ballon C. A methodology for the functional power integration. In: Proc EPE'97, Trondheim. Brussels: EPE Association, 1997. p. 1.296–1.301
2. Sanchez J-L, Austin P, Berriane R, Marmouget M. Trends in design and technology for new power integrated devices based on functional integration. In: Proc EPE'97, Trondheim. Brussels: EPE Association, 1997. p. 1.302–1.307
3. pn-junctions with blocking capabilities beyond 2.5 kV produced by rapid thermal processing;Nagel;Solid-St Electron,1996
4. A silicon-based three-dimensional neural interface: manufacturing process for an intracortical electrode array;Campbell;IEEE Trans on Biomed Engng,1991
5. Random walk of liquid droplets migrating in silicon;Cline;J Appl Phys,1976
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献