AW-7075-T6 sheet for shock heat treatment forming process
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference17 articles.
1. Influence of temper on the performance of a high-strength Al-Zn-Mg alloy sheet in the warm forming processing chain [J];KUMAR;Journal of Materials Processing Technology,2015
2. Room temperature forming of AA7075 aluminium alloys: W-temper process [J];de ARGANDOÑA;Key Engineering Materials,2015
3. Tube-hydroforming experiments on an Al 7003 extruded tube [J];CERETTI;Journal of Materials Processing Technology,2006
4. Reducing the susceptibility of alloys, particularly aluminium alloys, to stress corrosion cracking [P];BARUCH,1974
5. Evolution of precipitate microstructures during the retrogression and re-ageing heat treatment of an Al–Zn–Mg–Cu alloy [J];MARLAUD;Acta Materilia,2010
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1. Feasibility study on contact heating warm forming of 7075-T6 aluminum alloy;Archives of Civil and Mechanical Engineering;2023-07-21
2. The effect of rolling temperature on the microstructure and properties of multi pass rolled 7A04 aluminum alloy;Journal of Materials Research and Technology;2023-07
3. Al7075-T6 sac malzemede tavlamanın şekillendirilebilirlik ve geri esnemeye etkilerinin deneysel araştırılması;Gazi Üniversitesi Mühendislik-Mimarlık Fakültesi Dergisi;2021-01-18
4. Toward an Efficient Industrial Implementation of W-temper Forming for 7xxx Series Al Alloys;Forming the Future;2021
5. Optimizing Heat Treatment Parameters for the W-Temper Forming of 7xxx Series Aluminum Alloys;Metals;2020-10-12
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