Development of processing windows for diffusion bonding of Ti–6Al–4V titanium alloy and 304 stainless steel with silver as intermediate layer
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference27 articles.
1. Diffusion bonding technology of a titanium alloy to a stainless steel web with a Ni interlayer [J];PENG;Materials Characterization,1999
2. Optimization of Nd: Yag laser welding parameters for sealing small titanium tube ends [J];LEE;Material Science and Engineering A,2006
3. Effect of current pulsing on tensile properties of titanium alloy [J];BALASUBRAMANIAN;Journal of Materials and Design,2008
4. Research on the microstructure and properties of weld repair in TA15 titanium alloy [J];LIU;Material Science and Engineering A,2007
5. Freedom fabrication of titanium metal and intermetallic alloys by three dimensional micro welding [J];KATOU;Materials and Design,2007
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