Microstructural development and its effects on mechanical properties of Al/Cu laminated composite

Author:

LI Xiao-bing,ZU Guo-yin,WANG Ping

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference25 articles.

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2. On the interface development and fracture behaviour of roll bonded copper aluminium metal laminates [J];PENG;Journal of Materials Science,1999

3. Solid-state bonding between Al and Cu by vacuum hot pressing [J];LEE;Transactions of Nonferrous Metals Society of China,2013

4. Interfacial energy and match of cold pressure welded Ag/Ni and Al/Cu [J];LI;Transactions of Nonferrous Metals Society of China,2002

5. Progress in cold roll bonding of metals [J];LI;Science and Technology of Advanced Materials,2008

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