Microstructure evolution and properties of Cu–20Ni–20Mn alloy during aging process

Author:

XIE Wei-bin,WANG Qiang-song,MI Xu-jun,XIE Guo-liang,LIU Dong-mei,GAO Xue-cheng,LI Yang

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference17 articles.

1. BOEGEL A, OHLA K, MUELLER H R. Copper–nickel–manganese alloy, products made therefrom and method of manufacture of products therefrom: United States, US 6811623B2 [P]. 2004–11–02.

2. Microhardness of Cu–Ni–Mn alloy reduced by etching reagents [J];BOBYLEV;Metal Science and Heat Treatment,1962

3. The study of the initial stages of structural transformation in a Cu–20Ni–20Mn alloy [J];RONDOT;Acta Metallurgica,1978

4. Phase diagram of the Cu–Ni–Mn system [J];BAZHENOV;Russian Journal of Nonferrous Metals,2013

5. Experimental investigation and thermodynamic modeling of the Cu-Mn-Ni system [J];SUN;Calphad,2009

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