Smart-microstructures of composites for electrical contacts with frameless packing of Cr and W in copper

Author:

BODROVA L.E.,MELCHAKOV S. Yu.,SHUBIN A.B.,GOYDA E. Yu.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference42 articles.

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2. Current status and developing trends of Cu–Cr manufacturing technique contact materials for VCB [C];MIAO,2004

3. Self formed Cu–W functionally graded material produced via powder segregation [J];JANKOVIC ILIC;Advanced Engineering Materials,2007

4. Bond strength of W–Cu/CuCr integrated material [J];FAN;Transactions of Nonferrous Metals Society of China,2001

5. A novel approach for fabrication of functionally graded W/Cu composites via microwave processing [J];ZHOU;Journal of Alloys and Compounds,2018

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