Residual compressive and thermophysical properties of 4D carbon/carbon composites after repeated ablation under oxyacetylene flame of 3000 °C
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference17 articles.
1. Carbon–carbon composites [M];SAVAGE,1993
2. Carbon/carbon materials and composites [M];UCKLEY,1993
3. The future of carbon-carbon composites [J];FITZER;Carbon,1987
4. Characterisation of wear particles from biomedical carbon/carbon composites with different preforms in hip joint simulator [J];ZHANG;Transactions of Nonferrous Metals Society of China,2012
5. Damage modeling of a 4D carbon/carbon composite for high temperature application [J];AUBARD;Ceramic International,2000
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