Microstructure and properties of Al/Cu bimetal in liquid–solid compound casting process

Author:

HU Yuan,CHEN Yi-qing,LI Li,HU Huan-dong,ZHU Zi-ang

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference36 articles.

1. Electrical, corrosion, and mechanical properties of aluminum–copper joints produced by explosive welding [J];ACARER;Journal of Materials Engineering and Performance,2012

2. Growth behavior of Al/Cu intermetallic compounds in hot-dip aluminized copper [J];ZHEN;Surface and Interface Analysis,2009

3. Effects of annealing on the mechanical and interface properties of stainless steel/aluminum/copper clad–metal sheets [J];LEE;Journal of Materials Processing Technology,2007

4. Research progress on bonding mechanism and interface reaction of Al/Cu laminated composite [J];ZHAO;Hot Working Technology,2011

5. Formation of ultra-fine copper grains in copper-clad aluminum wire [J];SASAKE;Scripta Materialia,2010

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