Voltage-induced material removal mechanism of copper for electrochemical-mechanical polishing applications-Reference-Cited by-同舟云学术

Voltage-induced material removal mechanism of copper for electrochemical-mechanical polishing applications

Published:2009-09 Issue: Volume:19 Page:s262-s265
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

HAN Sang-Jun,SEO Yong-Jin

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference13 articles.

1. Global planarization characteristics of shallow trench isolation-chemical mechanical polishing process with and without reverse moat etch step[J];SEO;Journal of the Korean Physical Society,2003

2. Effects of mixed abrasive slurry in oxide-chemical mechanical polishing[J];SEO;Journal of the Korean Physical Society,2004

3. Chemical mechanical polishing characteristics of barium titanate thin films using mixed abrasive slurry[J];SEO;Journal of the Korean Physical Society,2006

4. A study on the electrochemical and the chemical mechanical polishing behaviors of W and Ti film[J];SEO;Journal of the Korean Physical Society,2007

5. Relative roles of H2O2 and glycine in CMP of copper studied with impedance spectroscopy[J];LU;Journal of Electrochemical Society,2004

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on the Electrorheological Ultra-Precision Polishing Process with an Annular Integrated Electrode;Micromachines;2021-10-12

2. Highly efficient and damage-free polishing of GaN (0 0 0 1) by electrochemical etching-enhanced CMP process;Applied Surface Science;2020-06

3. The optimization of FA/O barrier slurry with respect to removal rate selectivity on patterned Cu wafers;Journal of Semiconductors;2016-02

4. Planarization effect evaluation of acid and alkaline slurries in the copper interconnect process;Journal of Semiconductors;2015-03

5. Effect of pulse time on surface characteristics and corrosion resistance during pulse electrochemical polishing;Transactions of Nonferrous Metals Society of China;2012-12