Microstructure and thermal conductivity of submicron Si3N4 reinforced 2024Al composite

Author:

YANG Wen-shu,XIU Zi-yang,CHEN Guo-qin,WU Gao-hui

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference16 articles.

1. Properties of silicon nitride for aluminum melts prepared by nitrided pressureless sintering [J];HAN;Journal of the European Ceramic Society,2008

2. Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films [J];HUANG;Mater Sci Engineering A,2006

3. Characterization and wear behavior of modified silicon nitride [J];CARRASQUERO;International Journal of Refractory Metals and Hard Materials,2005

4. Mechanism of reaction infiltration of pressureless infiltrated Si3N4/Al composite [J];WANG;Rare Metal Materials and Engineering,2007

5. Study on material Al-Si3N4 infiltration technique [J];WU;Mining and Processing Equipment,2007

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