Author:
Lakhani Salim,Wang Yi,Milenković Aleksander,Milutinović Veljko
Reference21 articles.
1. Systolic arrays (for VLSI);Kung,1979
2. Why systolic architecture?;Kung;IEEE Computer,1982
3. Thermal conduction module: A high-performance multilayer ceramic package;Blodgett;IBM J. Res. Dev.,1982
4. SOI — A candidate for VLSI?;Gibbons;VLSI Design,1982
5. Three-dimensional VLSI architecture for image understanding;Nudd;J. Parallel Distributed Comput.,1985
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators;2021 22nd International Symposium on Quality Electronic Design (ISQED);2021-04-07
2. 3D Software: A New Research Imperative;Computer;2017
3. Systolic opportunities for multidimensional data streams;IEEE Transactions on Parallel and Distributed Systems;2002-04
4. A quantitative analysis of wiring lengths in 2D and 3D VLSI;Microelectronics Journal;1998-06
5. A review of 3-D packaging technology;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1998