Analyzing the solutions of DEA through information visualization and data mining techniques: SmartDEA framework
Author:
Publisher
Elsevier BV
Subject
Artificial Intelligence,Computer Science Applications,General Engineering
Reference53 articles.
1. An application reference for data envelopment analysis in branch banking: Helping the Novice researcher;Avkıran;International Journal of Bank Marketing,1999
2. A flexible deterministic, stochastic and fuzzy data envelopment analysis approach for supply chain risk and vendor selection problem: Simulation analysis;Azadeh;Expert Systems with Applications,2010
3. Some models for estimating technical and scale inefficiencies in data envelopment analysis;Banker;Management Science,1984
4. DEA software tools and technology: A state-of-the-art survey;Barr,2004
5. Applied data envelopment analysis;Boussofiane;European Journal of Operational Research,1991
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