Study on the law of multiparameter in dipping process-Reference-Cited by-同舟云学术

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Study on the law of multiparameter in dipping process

Published:2018-01 Issue: Volume:152 Page:84-91
ISSN:0030-4026
Container-title:Optik
language:en
Short-container-title:Optik

Author:

Chen Xinxin,Zhang Xiaorui,Li Junhui,Zhu Wenhui

Funder

China High Technology R&D Program 973

Discovery Project of State Key Laboratory of High Performance Complex Manufacturing

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Development of copper wire bonding application technology;Toyozawa;IEEE Trans. Compon. Hybrids Manuf. Technol.,1990

2. Wire bonding: present and future trends;Chen;Proc. 15th IEEE/CHMT Int. Electron. Manuf. Technol. Symp.,1993

3. Using a low-temperature carbon electrode for preparing hole-conductor-free perovskite heterojunction solar cells under high relative humidity;Liu;Nanoscale,2016

4. Bonding wire options and their impact on product reliability;Vath;Proc. 12th Int. Conf. Electron. Packag. Technol. High Density Packag. (ICEPT-HDP),2011

5. Enhanced photovoltaic performance and stability of carbon counter electrode based perovskite solar cells encapsulated by PDMS;Liu;J. Mater. Chem. A,2016

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