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Electrodeposition of Lead-Tin Alloys

Published:1963 Issue: Volume: Page:4-29
ISSN:
Container-title:Electrodeposition of Alloys
language:
Short-container-title:

Author:

Brenner Abner

Publisher

Elsevier

Reference66 articles.

1. J. F. GROFF, Process of electroplating. U. S. Patent 1,364,051 (1920).

2. C. H. CHANDLER, Plating. U. S. Patent 1,373,488 (1921).

3. The electrodeposition of lead-tin alloys;BLUM;Trans. Am. Electrochem. Soc.,1921

4. Electrolytic coatings of lead-tin alloys;BELIAEV;Khimstroî,1933

5. Electrodeposition of lead-tin alloys;BELIAEV;Novosti Tekh.,1936

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1. The Effect of a Substrate Material on Composition Gradients of Fe-Ni Films obtained by Electrodeposition;Scientific Reports;2020-01-23

2. Characterization and Holographic study of nanostructure Copper Selenide thin films grown at room temperature;Materials Today: Proceedings;2020

3. Ni- and Sb-Doped SnO2 Electrocatalysts with High Current Efficiency for Ozone Production via Electrodeposited Nanostructures;Journal of The Electrochemical Society;2018

4. Effect of Current Density on Deposit Characters of Zn-Co Alloy and their Corrosion Behaviors;Synthesis and Reactivity in Inorganic, Metal-Organic, and Nano-Metal Chemistry;2011-04-21

5. Composition Control of the Eutectic Sn-Based Alloys: Sn-Ag, Sn-Cu, Sn-Ag-Cu, From Simple Plating Baths;Journal of The Electrochemical Society;2011

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