Adhesives for Electronics-Reference-Cited by-同舟云学术

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Adhesives for Electronics

Published:2011 Issue: Volume: Page:259-299
ISSN:
Container-title:Handbook of Adhesives and Surface Preparation
language:
Short-container-title:

Author:

Rabilloud Guy

Publisher

Elsevier

Reference78 articles.

1. Handbook of Epoxy Resins;Lee,1987

2. Epoxy Resins, Chemistry and Technology,1988

3. Chemistry and Technology of Epoxy Resins;Ellis,1994

4. High-Performance Polymers, Chemistry and Applications. Vol 1, Conductive Adhesives;Rabilloud,1997

5. Soldering deterioration of epoxy-molded IC packages after moisture absorption

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Failure Analysis of Epoxy Resin Encapsulant During a Long-Term Storage;Handbook of Case Histories in Failure Analysis;2019-12-01

2. Failure Analysis of Epoxy Resin Encapsulant During a Long-Term Storage;Journal of Failure Analysis and Prevention;2013-07-24

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