Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages
Author:
Publisher
Elsevier BV
Subject
General Engineering,General Materials Science
Reference24 articles.
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2. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints;Tu;IEEE Trans Comp Packag Manuf Technol B,1997
3. Intermetallic compound layer development during the solid state thermal aging of 63Sn–37Pb solder/Au–Pt–Pd thick film couples;Vianco;IEEE Trans Comp Packag Manuf Technol A,1997
4. Effect of intermetallic compounds on the shear fatigue of Cu/63Sn–37Pb solder joints;Chan;IEEE Trans Comp Packag Manuf Technol B,1997
5. Characterization of the growth of intermetallic interfacial layers of Sn–Ag and Sn–Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging;Choi;J Electron Mater,1999
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