Sound transmission analysis of plate structures using the finite element method and elementary radiator approach with radiator error index
Author:
Funder
NRF
Publisher
Elsevier BV
Subject
General Engineering,Software
Reference27 articles.
1. Sound propagation: an impedance based approach;Kim,2010
2. Sound and structural vibration: radiation, transmission and response;Fahy,2012
3. An empirical scheme to predict the sound transmission loss of single-thickness panels;Callister;J Sound Vib,1999
4. Analysis of sound transmission through periodically stiffened panels by space-harmonic expansion method;Lee;J Sound Vib,2002
5. A review of analytical methods, based on the wave approach, to compute partitions transmission loss;Pellicier;Appl Acoust,2007
Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Experimental validation of a topology optimized 2D sandwich panel for sound transmission minimization;Mechanical Systems and Signal Processing;2024-04
2. Optimization of material thickness distribution in single and double partition panels for maximized sound insulation;Structural and Multidisciplinary Optimization;2023-11-16
3. The Radiation Efficiency Measurements of Real System of a Thin Circular Plate Embedded Into a Thick Square Baffle;Archives of Acoustics;2023-07-26
4. Fast vibro-acoustic response computations for finite periodic metamaterial plates using a generalized Bloch Mode Synthesis based sub-structuring approach;Frontiers in Mechanical Engineering;2022-11-11
5. Impact of the acoustic transmission path on the vibro-acoustic performance of sandwich panels with structural cores with bandgap behavior;Applied Acoustics;2022-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3