An Eulerian interface sharpening algorithm for compressible two-phase flow: The algebraic THINC approach
Author:
Publisher
Elsevier BV
Subject
Computer Science Applications,Physics and Astronomy (miscellaneous),Applied Mathematics,Computational Mathematics,Modelling and Simulation,Numerical Analysis
Reference64 articles.
1. A five-equation model for the simulation of interface between compressible fluids;Allaire;J. Comput. Phys.,2002
2. An investigation of interface-sharpening schemes for multi-phase mixture flows;Cassidy;J. Comput. Phys.,2009
3. A high order ENO conservative Lagrangian type scheme for the compressible Euler equations;Cheng;J. Comput. Phys.,2007
4. Contact discontinuity capturing schemes for linear advection and compressible gas dynamics;Després;J. Sci. Comput.,2001
5. Front tracking applied to Rayleigh–Taylor instability;Glimm;SIAM J. Sci. Stat. Comput.,1986
Cited by 119 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A family of TENOA-THINC-MOOD schemes based on diffuse-interface method for compressible multiphase flows;Journal of Computational Physics;2024-12
2. Numerical investigation on the interaction characteristics between the gaseous detonation wave and the water droplet;Combustion and Flame;2024-11
3. On immiscibility preservation conditions of material interfaces in the generic five-equation model;Journal of Computational Physics;2024-09
4. High-resolution boundary variation diminishing scheme for two-phase compressible flow with cavitation and evaporation;Journal of Computational Physics;2024-09
5. Numerical study of underwater explosion bubble dynamics based on a six-equation model;Physics of Fluids;2024-08-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3