Metal lift-off using a trilevel resist system for electron beam lithography-Reference-Cited by-同舟云学术

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Metal lift-off using a trilevel resist system for electron beam lithography

Published:1987-01 Issue:1 Volume:7 Page:11-20
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Etrillard J.,Bellessa J.,Izrael A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Multilayer resist system and processing;Lin;Solid State Technol.,1983

2. High resolution step profile resist pattern;Moran;J. Vac. Sci. Technol.,1979

3. Multilayer resist system for VLSI lithography;Kaplan;RCA Rev.,1983

4. Multilayer resist for fine line optical lithography;Ong;Solid State Technol.,1984

5. Application de la gravure ionique réactive à la technologie tri-couche;Etrillard;Thése Conservatoire National des Arts et Métiers,1985

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Surface-Enhanced Infrared Spectroscopy Using Metal Oxide Plasmonic Antenna Arrays;Nano Letters;2013-12-18

2. Reactive Ion Etching of Gallium Arsenide inCCl2F2andSiCl4Plasmas: Influence of Chamber Material and Etching Mask;Japanese Journal of Applied Physics;1994-07-15

3. Inverted resist multilayer system for high-definition pattern lithography;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1990-01

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