Author:
Carey Paul G.,Woratschek Bertram J.,Bachmann Friedrich
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Planarization of ULSI topography over variable pattern densities;Daubenspeck;J. Electrochem. Soc.,1991
2. Application of chemical mechanical polishing to the fabrication of VLSI circuit interconnections;Patrick;J. Electrochem. Soc.,1991
3. Chemical-mechanical polishing for fabricating patterned W metal features as chip interconnects;Kaufman;J. Electrochem. Soc.,1991
4. Tungsten contact hole filling in a high vacuum CVD-system;Hieber,1987
5. Junction leakage of selectivity deposited LPCVD Tungsten for contact fill applications;Yang,1987
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3 articles.
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