1. A buried-plate trench cell for a 64M DRAM;Kenney,1992
2. High density damascene wiring and borderless contacts for 64M DRAM;Roehl;Proc. 9th Int. VLSI Multilevel Interconnect Conf.,1992
3. Advanced lithography for sub-half micron geometry;Arden,1991
4. Deep ultraviolet lithography for 500-nm devices;Holmes;SPIE,1990
5. Step and scan: A systems overview of a new lithography tool;Buckley;SPIE,1989