Polyimide coating on non-planar microelectronic devices: characterization of vacuum drying effects by a new ‘flip–paste’ back-etching method-Reference-Cited by-同舟云学术

Polyimide coating on non-planar microelectronic devices: characterization of vacuum drying effects by a new ‘flip–paste’ back-etching method

Published:1999-12 Issue:2-3 Volume:122 Page:214-218
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Sidorov V.,Shai A.,Ritter D.,Paz Y.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference9 articles.

1. Polyimide passivation of In0.53Ga0.47As, InP, and InGaAsP/InPp‐njunction structures

2. AlGaAs/GaAs HBTs fabricated by a self-alignment technology using polyimide for electrode separation

3. Thin Films Processes;Kern,1978

4. Reduction of base-collector capacitance by undercutting the collector and subcollector in GaInAs/InP DHBTs

5. Proceedings of the 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY;Sidorov,1998

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applications of polyimide coatings: a review;SN Applied Sciences;2021-02-23

2. Nanodimensional layers based on polyamic acids and polyamidoimides as protective and passivate coatings in laser AlGaAs/GaAs heterostructures;Nanotechnologies in Russia;2011-06

3. Multilayered Gold-Nanoparticle/Polyimide Composite Thin Film through Layer-by-Layer Assembly;Langmuir;2007-08-24

4. Cross-linked polyimide–polythiophene composite films with reduced surface resistivities;Thin Solid Films;2005-05

5. Passivation of InP surfaces of electronic devices by organothiolated self-assembled monolayers;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2003