Progress in microwave absorbing materials: A critical review
Author:
Funder
Department of Science and Technology, Ministry of Science and Technology, India
Publisher
Elsevier BV
Reference342 articles.
1. Emerging materials and designs for low-and multi-band electromagnetic wave absorbers: the search for dielectric and magnetic synergy?;Cheng;Adv Funct Mater,2022
2. 2D MXenes for electromagnetic shielding: a review;Iqbal;Adv Funct Mater,2020
3. Multifunctional MXene/C aerogels for enhanced microwave absorption and thermal insulation;Wu;Nano-Micro Lett,2023
4. Assembling nano–microarchitecture for electromagnetic absorbers and smart devices;Wang;Adv Mater,2020
5. Hump-inspired hierarchical fabric for personal thermal protection and thermal comfort management;Xu;Adv Funct Mater,2023
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