Achieving Reliable CoSb3 based thermoelectric joints with low contact resistivity using a high-entropy alloy diffusion barrier layer
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Electronic, Optical and Magnetic Materials
Reference47 articles.
1. Interfacial reactions at the joints of CoSb 3 -based thermoelectric devices
2. A review of thermoelectrics research – Recent developments and potentials for sustainable and renewable energy applications
3. Skutterudite Thermoelectric Modules with High Volume-Power-Density: Scalability and Reproducibility
4. High pressure synthesized Ca-filled CoSb3 skutterudites with enhanced thermoelectric properties
5. Temperature dependent solubility of Yb in Yb–CoSb3 skutterudite and its effect on preparation, optimization and lifetime of thermoelectrics
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Structural evolutions and tribological properties of laser cladded FeCoNiCrMo high-entropy alloy coating by laser remelting and tempering process: TEM and DFT calculations;Tribology International;2024-11
2. Advancements in diffusion barrier layers based on heterogeneous connection of electrode/thermoelectric materials;Journal of Alloys and Compounds;2024-10
3. Thermal stability optimization of single-leg skutterudite-based thermoelectric devices based on lattice distortion effects;Journal of Materiomics;2024-04
4. Interface Layer of Te-based Thermoelectric Device: Abnormal Growth and Interface Stability;Journal of Inorganic Materials;2024
5. Joining of p-type skutterudite and Cu electrodes with a laser patterned interfacial structure;Materials Letters;2023-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3