Construction of the differential surface admittance operator with an extended Fokas method for electromagnetic scattering at polygonal objects with arbitrary material parameters-Reference-Cited by-同舟云学术

Construction of the differential surface admittance operator with an extended Fokas method for electromagnetic scattering at polygonal objects with arbitrary material parameters

Published:2022-12 Issue: Volume:128 Page:44-54
ISSN:0898-1221
Container-title:Computers & Mathematics with Applications
language:en
Short-container-title:Computers & Mathematics with Applications

Author:

Bosman Dries^ORCID,Huynen Martijn^ORCID,De Zutter Daniël^ORCID,Vande Ginste Dries^ORCID

Publisher

Elsevier BV

Subject

Computational Mathematics,Computational Theory and Mathematics,Modeling and Simulation

Reference33 articles.

1. Finite Elements for Electrical Engineers;Silvester,1996

2. Calculation of MoM interaction integrals in highly conductive media;Peeters;IEEE Trans. Antennas Propag.,2012

3. Inductance evaluation of CPW with Co-Zr-Nb film using magnetic circuit analysis;Muroga;J. Electron. Mater.,2019

4. Electromagnetic modeling of high magnetic contrast media using Calderón preconditioning;Gossye;Comput. Math. Appl.,2019

5. Skin effect modeling based on a differential surface admittance operator;De Zutter;IEEE Trans. Microw. Theory Tech.,2005

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