Thermal properties of sandy and peat soils under unfrozen and frozen conditions
Author:
Funder
CANADA’S OIL SANDS INNOVATION ALLIANCE (COSIA), Canada
Publisher
Elsevier BV
Subject
Earth-Surface Processes,Soil Science,Agronomy and Crop Science
Reference49 articles.
1. Soil thermal conductivity: effects of density, moisture, salt concentration, and organic matter;Abu-Hamdeh;Soil Sci. Soc. Am. J.,2000
2. Low temperature limits of root growth in deciduous and evergreen temperate tree species;Alvarez-Uria;Funct. Ecol.,2007
3. Soil Physics With Python;Bittelli,2015
4. Effect of organic matter on the water-holding capacity and the wilting point of mineral soils;Bouyoucos;Soil Sci.,1939
5. Measurement of soil thermal properties with a dual-probe heat-pulse technique;Bristow;Soil Sci. Soc. Am. J.,1994
Cited by 48 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Temporal variability in water content, temperature, and electrical conductivity of sandy soil: Responses to soil-improving cropping systems (SICS);Soil and Tillage Research;2024-10
2. The Effects of Different Soil Substrates on the Growth and Root Coixol Content of Local Coix Varieties in China;Agronomy;2024-08-14
3. Predicting soil thermal properties in freeze-thaw cycles using EFAttNet: A comparative analysis;PLOS ONE;2024-07-12
4. Pore unit cell network modeling of the thermal conductivity dynamics in unsaturated sandy soils: Unveiling the role of spanning‐wetting phase cluster;Vadose Zone Journal;2024-06-08
5. Thermal Modeling of Geosynthetics and Earth Structures in a Changing Climate: Overview and Future Challenges;International Journal of Geosynthetics and Ground Engineering;2024-03-18
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3