Characteristics of “dynamic hard particles” in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear-Reference-Cited by-同舟云学术

Characteristics of “dynamic hard particles” in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

Published:2007-09 Issue:7-12 Volume:263 Page:1459-1466
ISSN:0043-1648
Container-title:Wear
language:en
Short-container-title:Wear

Author:

Cai M.B.,Li X.P.,Rahman M.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference21 articles.

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2. Energy scaling transitions in machining of silicon by diamond;Puttick;Tribol. Int.,1995

3. Diamond cutting of silicon with nanometric finish;Fang;Ann. CIRP,1998

4. Diamond turning of silicon substrates in ductile-regime;Leung;J. Mater. Process. Technol.,1998

5. On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications;Yan;Mater. Sci. Eng. A,2001

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